
The source of surface contamination is likely to be impurities during equipment assembly and metal particles generated during switch operation, which will reduce flashover voltage and increase dispersion. In addition, arc discharge and corona discharge during operation will cause SF6 gas decomposition to produce low fluoride SF4, SOF2, SO2F2, etc. Under the action of water and oxygen, corrosive HF and SO2 will be generated, making the insulation material corroded and deteriorated, and the insula
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